
Using modular concepts, our components allow:
- Quick development of specially adapted components
- Quick adaptation, modification, retrofitting and refitting
- Use in stand-alone machines or complete production lines
- Recognition and classification of faults and fault characteristics
- Networking and database connection
- Automated handling and process control
- Remote maintenance
Choise of application areas
Wafer technology
- Silicon substrate production
- Drawing process monitoring
- Wafer production
- Dirt, saw groove and scratch inspection
- Cell production
- Microcrack inspection
- Edge-break control
- Front and back print control
- Colour monitoring
- Finger Inspection
- Module production
- Position determination
- String process monitoring
Thin film technology
- Front-end
- Interface control
- Tracking
- Back-end
- Contact control
- Position determination
