28.06.2012

Warp test

Improved quality and reduced production time and costs using a unique test process

A unique concept in wafer production not only optimises quality and throughput, but also considerably reduces production times.
Warp control deals with testing the wafer's bow and warp values. This can be achieved using image processing, which determines the wafer's warp using optical controls. This means that unnecessary downtime and wafer breakages can be avoided during the consequent assembly or printing.

Typical laser processes are slow and problematic on the grain boundaries of polycrystalline wafers. Image processing can lead to faster and considerably more precise work.

Fig. 1: Wafer on conveyor
Fig. 2: Sketch of a cross-section through a curved wafer

You can obtain more information from our partner Buchanan Systems.